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| doc. no : qw0905-la110b/xxxy-pf rev. : a date : 08 - mar. - 2010 data sheet led array la110b/xxxy-pf pb lead-free parts ligitek electronics co.,ltd. property of ligitek only l dcc
+ - note : 1.all dimension are in millimeter tolerance is part no. la110b/xxxy-pf 2.7 ? ???? page 2/5 unit ma ma absolute maximum ratings ? 3.0 2.5 1.5 1.0 0.5 0.0 2.0 fig.4 relative intensity vs. temperature 1.0 r e l a t i v e i n t e n s i t y @ 2 0 m a 550 wavelength (nm) 500 0.0 0.5 600650700 ambient temperature( dip soldering preheat: 120 25 0 0 50 120 100 150 temp( 260 the purpose of this test is the resistance of the device under tropical for hours. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. 1.t.sol=230 |
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